Fabricating method of thin film transistor

ABSTRACT

A thin film transistor including a substrate, a semiconductor layer, a patterned doped semiconductor layer, a source and a drain, a gate insulation layer, and a gate is provided. The semiconductor layer is disposed on the substrate. The patterned doped semiconductor layer is disposed on opposite sides of the semiconductor layer. The source and the drain are disposed on the patterned doped semiconductor layer and the opposite sides of the semiconductor layer, wherein a part of the semiconductor layer covered by the source and the drain has a first thickness, a part of the semiconductor layer disposed between the source and the drain and not covered by the source and the drain has a second thickness ranging from 200 Å to 800 Å. The gate insulation layer is disposed on the source, the drain and the semiconductor layer. The gate is disposed on the gate insulation layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of and claims the prioritybenefit of U.S. application Ser. No. 13/084,581, filed on Apr. 12, 2011,now allowed, which claims the priority benefit of Taiwan applicationserial no. 99129890, filed on Sep. 3, 2010. The entirety of each of theabove-mentioned patent applications is hereby incorporated by referenceherein and made a part of specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a semiconductor device and a fabricating methodthereof, and more particularly to a thin film transistor and afabricating method thereof.

2. Description of Related Art

Along with the maturation of photoelectrical technology andsemiconductor fabrication technology, flat displays have been developedvigorously. Flat displays have gradually replaced the conventionalcathode ray tube (CRT) displays and become the mainstream of displayproducts recently for the advantages of low voltage operation, free ofradiation scattering, light weight, and compact volume. Generally,liquid crystal displays (LCDs) can be categorized into amorphous siliconthin film transistors (TFT) and low temperature polysilicon TFTs.

Having higher carrier mobility and device stability, low temperaturepolysilicon TFTs can be widely applied in product design. However, asthe development progresses to large-sized panels, low temperaturepolysilicon TFTs is limited to its fabrication temperature and thespecification of the machine, and thus cannot be applied in large-sizespanels. For example, in the fabrication of low temperature polysiliconTFTs, doped regions have to be formed by implantation. Nevertheless, thespecification of the conventional implantation machines fails toincorporate the fabrication of large-sized panels to form lowtemperature polysilicon TFTs. In contrast, the fabrication of amorphoussilicon TFTs satisfies the demands for large area production. As aconsequence, the combination of the polysilicon fabrication and theamorphous silicon fabrication is proposed for fabricating polysiliconTFTs. For instance, crystallized parts of the polysilicon TFTs areformed by crystallization methods such as the solid phasecrystallization (SPC), and the remaining parts are completed in theassembly line of the amorphous silicon TFTs to prevent the use of dopingmachines. As shown from experiments, the structural properties of thepolysilicon TFTs formed by the method aforementioned are affected by theetching process performed to the channel layer, and the devicecharacteristics are evidently affected by the structure of the channellayer.

SUMMARY OF THE INVENTION

The invention is directed to a thin film transistor (TFT) and afabricating method thereof, so that the TFT has superior devicecharacteristics.

The invention provides a thin film transistor including a substrate, asemiconductor layer, a patterned doped semiconductor layer, a source anda drain, a gate insulation layer, and a gate. The semiconductor layer isdisposed on the substrate. The patterned doped semiconductor layer isdisposed on opposite sides of the semiconductor layer. The source andthe drain are disposed on the patterned doped semiconductor layer and onthe opposite sides of the semiconductor layer. A part of thesemiconductor layer covered by the source and the drain has a firstthickness. A part of the semiconductor layer located between the sourceand the drain and not covered by the source and the drain has a secondthickness ranging from 200 Å to 800 Å. The gate insulation layer isdisposed on the source, the drain and the semiconductor layer. The gateis disposed on the gate insulation layer.

The invention further provides a fabricating method of a TFT. Asemiconductor layer having a first thickness is formed on a substrate. Apatterned doped semiconductor layer is formed on the semiconductorlayer. A source and a drain are formed on the patterned dopedsemiconductor layer. The source and the drain are disposed on oppositesides of the semiconductor layer, wherein a part of the semiconductorlayer located between the source and the drain and not covered by thesource and the drain has a second thickness ranging from 200 Å to 800 Å.A gate insulation layer is formed on the source and the drain to coverthe source and the drain, the patterned doped semiconductor layer, andthe semiconductor layer. A gate is formed on the gate insulation layer.

In light of the foregoing, in the TFT of the invention, a part of thesemiconductor layer located between the source and the drain and notcovered by the source and the drain has a thickness ranging from 200 Åto 800 Å, so that the TFT has superior device characteristics.

In order to make the aforementioned and other features and advantages ofthe invention more comprehensible, several embodiments accompanied withfigures are described in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide further understanding,and are incorporated in and constitute a part of this specification. Thedrawings illustrate exemplary embodiments and, together with thedescription, serve to explain the principles of the disclosure.

FIGS. 1A to 1D are schematic cross-sectional diagrams showing a flowchart of a fabricating method of a thin film transistor (TFT) accordingto a first embodiment of the invention.

FIGS. 2A to 2D are schematic cross-sectional diagrams showing a flowchart of a fabricating method of a TFT according to a second embodimentof the invention.

DESCRIPTION OF EMBODIMENTS First Embodiment

FIGS. 1A to 1D are schematic cross-sectional diagrams showing a flowchart of a fabricating method of a thin film transistor (TFT) accordingto a first embodiment of the invention. Referring to FIG. 1A, asemiconductor layer 104 having a first thickness t1 is formed on asubstrate 102. In the present embodiment, the substrate 102 is a glasssubstrate, a quartz substrate, or a substrate of other material, and theinvention is not limited thereto. The semiconductor layer 104 is, forexample, a polysilicon layer formed by a deposition method or acrystallization method. In the present embodiment, an amorphous siliconlayer (not shown) is formed on the substrate 102, for example. Theamorphous silicon layer is transformed into a polysilicon layer througha crystallization method such as a solid phase crystallization (SPC)method, an excimer laser annealing (ELA) method, and so on. Here, thefirst thickness t1, for instance, ranges from 200 Å to 800 Å, andpreferably ranges from 300 Å to 400 Å.

Referring to FIG. 1B, a patterned doped semiconductor layer 110 isformed on the semiconductor layer 104. In the present embodiment, thepatterned doped semiconductor layer 110 is formed by, for instance, thefollowing. A doped semiconductor material layer (not shown) is formed onthe semiconductor layer 104. A part of the doped semiconductor materiallayer is removed to form the patterned doped semiconductor layer 110. Inthe present embodiment, the patterned doped semiconductor layer 110, forinstance, includes an N-type dopant and is formed by a deposition methodor a doping process. For example, the patterned doped semiconductorlayer 110 is, for example, an N-type doped amorphous silicon layer andformed by a chemical vapor deposition (CVD) method, for example. Asshown in FIG. 1B, the patterned doped semiconductor layer 110 includes,for instance, a first doped semiconductor layer 112 and a second dopedsemiconductor layer 114. The first doped semiconductor layer 112 covers,for example, a first side surface 104 a of the semiconductor layer 104.The second doped semiconductor layer 114 covers, for example, a secondside surface 104 b of the semiconductor layer 104. The first sidesurface 104 a and the second side surface 104 b are located at oppositesides of the semiconductor layer 104. It should be noted that althoughthe doped semiconductor material layer is formed by using a depositionmethod in the present embodiment, in another embodiment, a semiconductormaterial layer can be first formed on the semiconductor layer 104, wherethe semiconductor material layer is performed with a doping process toform a doped semiconductor material layer. In other words, the patterneddoped semiconductor layer 110 can be formed by any conventional methodsand the invention is not limited thereto.

Referring to FIG. 1C, a source 120 and a drain 122 are formed on thepatterned doped semiconductor layer 110. The source 120 and the drain122 are disposed on the opposite sides of the semiconductor layer 104. Apart of the semiconductor layer 140 located between the source 120 andthe drain 122 and not covered by the source 120 and the drain 122 has asecond thickness t2 ranging from 200 Å to 800 Å. In the presentembodiment, a conductor layer (not shown) is formed on the patterneddoped semiconductor layer 110 and then patterned to form the source 120and the drain 122 on the opposite sides of the semiconductor layer 104and expose the semiconductor layer 104 located between the source 120and the drain 122. The source 120 and the drain 122 are fabricated with,for example, titanium, aluminum, molybdenum, and a combination thereof,or other conductive material. The source 120 and the drain 122 areformed by a physical vapor deposition (PVD) method, for example. In thepresent embodiment, an inner side edge 112 a of the first dopedsemiconductor layer 112 and an inner side edge 120 a of the source 120are, for example, substantially aligned. Moreover, an inner side edge114 a of the second doped semiconductor layer 114 and an inner side edge122 a of the drain 122 are, for instance, substantially aligned. Inanother embodiment, a doped semiconductor material layer (not shown) isformed on the semiconductor layer 104. A conductor layer (not shown) isformed on the doped semiconductor material layer. The conductor layerand the doped semiconductor material layer are simultaneously patternedwith the same photomask (not shown), and the invention is not limitedthereto.

In the present embodiment, after the semiconductor layer 104 is formed,a part of the semiconductor layer 104 is not removed. Thus, thesemiconductor layer 104 generally has an even thickness. That is, a partof the semiconductor layer 104 located between the source 120 and thedrain 122 and not covered by the source 120 and the drain 122 has thesame thickness as a part of the semiconductor layer 104 covered by thesource 120 and the drain 122. Therefore, the second thickness t2generally equals to the first thickness t1 and the second thicknesspreferably ranges from 300 Å to 400 Å.

Referring to FIG. 1D, a gate insulation layer 130 is formed on thesource 120 and the drain 122 to cover the source 120, the drain 122, andthe semiconductor layer 104. The gate insulation layer 130 is, forexample, fabricated with silicon oxide, silicon nitride, or otherinsulation material, and formed by a CVD method, for example. A gate 140is formed on the gate insulation layer 130. The gate 140 is fabricatedwith, for example, titanium, aluminum, molybdenum, and a combinationthereof, or other conductive material. The gate 140 is formed by a PVDmethod, for example. An insulation layer 150 is formed on the gate 140to cover the gate 140, the gate insulation layer 130, the source 120 andthe drain 122, and the semiconductor layer 104. The insulation layer 150is, for example, fabricated with silicon oxide, silicon nitride, orother insulation material, and formed by a CVD method, for example.

In the present embodiment, a TFT 100 includes the substrate 102, thesemiconductor layer 104, the patterned doped semiconductor layer 110,the source 120 and the drain 122, the gate insulation layer 130, thegate 140, and the insulation layer 150. The semiconductor layer 104 isdisposed on the substrate 102. The patterned doped semiconductor layer110 is disposed on the opposite sides of the semiconductor layer 104.The patterned doped semiconductor layer 110, for example, includes anN-type dopant. The patterned doped semiconductor layer 110, forinstance, includes the first doped semiconductor layer 112 and thesecond doped semiconductor layer 114. The first doped semiconductorlayer 112 is, for example, located between the semiconductor layer 104and the source 120 and covers the first side surface 104 a of thesemiconductor layer 104. The second doped semiconductor layer 114 is,for instance, located between the semiconductor layer 104 and the drain122 and covers the second side surface 104 b of the semiconductor layer104. The first side surface 104 a and the second side surface 104 b arelocated at the opposite sides of the semiconductor layer 104. In thepresent embodiment, the inner side edge 112 a of the first dopedsemiconductor layer 112 and the inner side edge 120 a of the source 120are, for example, substantially aligned. Moreover, the inner side edge114 a of the second doped semiconductor layer 114 and the inner sideedge 122 a of the drain 122 are, for instance, substantially aligned. Inother embodiments, the inner side edge 112 a of the first dopedsemiconductor layer 112 and the inner side edge 120 a of the source 120are, for example, not aligned. Or, the inner side edge 114 a of thesecond doped semiconductor layer 114 and the inner side edge 122 a ofthe drain 122 are, for instance, not aligned.

The source 120 and the drain 122 are disposed on the patterned dopedsemiconductor layer 110 and on the opposite sides of the semiconductorlayer 104. A part of the semiconductor layer 104 covered by the source120 and the drain 122 has the first thickness t1. A part of thesemiconductor layer 104 located between the source 120 and the drain 122and not covered by the source 120 and the drain 122 has a secondthickness t2 ranging from 200 Å to 800 Å. In the present embodiment, thesemiconductor layer 104 has an even thickness, for example. That is, thesecond thickness t2 generally equals to the first thickness t1. In otherwords, the thickness t1 of the semiconductor layer 104 covered by thesource 120 and the drain 122 generally equals to the thickness t2 of thesemiconductor layer 104 located between the source 120 and the drain 122and not covered by the source 120 and the drain 122. The first thicknesst1 and the second thickness t2 range, for example, from 300 Å to 400 Å.The gate insulation layer 130 is disposed on the source 120, the drain122 and the semiconductor layer 104. The gate 140 is disposed on thegate insulation layer 130. The insulation layer 150 is disposed on thegate 140 and the gate insulation layer 130 to cover the gate 140, thegate insulation layer 130, the source 120 and the drain 122, and thesemiconductor layer 104.

In general, the thickness of the semiconductor layer adopted as achannel layer affects the device characteristics of the TFT. Thus, inthe fabrication method of the TFT 100 of the present embodiment, thethickness of the semiconductor layer 104 is maintained from 200 Å to 800Å in the formation of the semiconductor layer 104, such that thethickness of the semiconductor layer 104 located between the source 120and the drain 122 and not covered by the source 120 and the drain 122ranges from 200 Å to 800 Å. As shown in experiments, when the thicknessof the semiconductor layer 104 not covered by the source 120 and thedrain 122 ranges from 200 Å to 800 Å, the TFT 100 has superior devicecharacteristics. In the present embodiment, the patterned dopedsemiconductor layer 110 is formed by a deposition method such as a CVDmethod, so that a doping machine is not required for forming thepatterned doped semiconductor layer 110. Therefore, the fabrication ofthe TFT 100 is not limited to the specification of the doping machineand can be incorporated with the conventional amorphous silicon TFTfabrication. In other words, the TFT and the fabricating method thereofallow the TFT to have superior device characteristics and satisfy thedemands for large area production to fabricate a TFT that can be adoptedin large-sized panels, so as to enhance the display quality of thepanel.

Second Embodiment

FIGS. 2A to 2D are schematic cross-sectional diagrams showing a flowchart of a fabricating method of a TFT according to a second embodimentof the invention. Referring to FIG. 2A, a semiconductor layer 104 havinga first thickness t1 is formed on a substrate 102. In the presentembodiment, the substrate 102 is a glass substrate, a quartz substrate,or a substrate of other material. The semiconductor layer 104 is, forexample, a polysilicon layer formed by a deposition method or acrystallization method. In the present embodiment, an amorphous siliconlayer (not shown) is formed on the substrate 102, for example. Theamorphous silicon layer is transformed into a polysilicon layer througha crystallization method such as a SPC method, an ELA method, and so on.The first thickness t1, for example, ranges from 300 Å to 2000 Å.

Referring to FIG. 2A, a doped semiconductor material layer 108 is formedon the semiconductor layer 104. For example, the doped semiconductormaterial layer 108 is, for example, an N-type doped amorphous siliconlayer and formed by a CVD method, for example. A conductor layer 118 isformed on the doped semiconductor material layer 108. The conductorlayer 118 is fabricated with, for example, titanium, aluminum,molybdenum, and a combination thereof, or other conductive material. Theconductor layer 118 is formed by a PVD method, for example. A patternedmask layer 119 is formed on the conductor layer 118. The patterned masklayer 119 covers opposite sides of the semiconductor layer 104. Inanother embodiment, the doped semiconductor material layer 108 and theconductor layer 118 are not defined simultaneously using the samepatterned mask layer, and the invention is not limited thereto.

Referring to FIG. 2C, the patterned mask layer 119 is used as a mask toremove a part of the conductor layer 118 and a part of the dopedsemiconductor material layer 108 so as to form a source 120, a drain122, and a patterned doped semiconductor layer 110. In the presentembodiment, after a part of the conductor layer 118 and a part of thedoped semiconductor material layer 108 are removed, a part of thesemiconductor layer 104 not covered by the source 120 and the drain 122is further removed, so that a part of the semiconductor layer 104 notcovered by the source 120 and the drain 122 has a second thickness t2ranging from 200 Å to 800 Å. Hence, the semiconductor layer 104 coveredby the source 120 and the drain 122 has the first thickness t1, thesemiconductor layer 104 located between the source 120 and the drain 122and not covered by the source 120 and the drain 122 has the secondthickness t2. In addition, the first thickness t1 is generally greaterthan the second thickness t2. A part of the conductor layer 118 and apart of the doped semiconductor material 108 are removed by, forinstance, performing a dry etching process or a wet etching process, orperforming a wet etching process followed by a dry etching process. Thepatterned mask layer 119 is then removed. It should be noted that in thepresent embodiment, the patterned mask layer 119 is adopted as a mask toremove a part of the doped semiconductor material layer 108 to form thepatterned doped semiconductor layer 110. However, in another embodiment,the patterned mask layer 119 can be removed after the source 120 and thedrain 122 are formed. Then, by using the source 120 and the drain 122 asmasks, a part of the doped semiconductor material layer 108 is removedto form the patterned doped semiconductor layer 110.

In the present embodiment, the patterned doped semiconductor layer 110includes, for instance, a first doped semiconductor layer 112 and asecond doped semiconductor layer 114. Since the source 120, the drain122, and the patterned doped semiconductor layer 110 are all formed byusing the patterned mask layer 119 as a mask, an inner side edge 112 aof the first doped semiconductor layer 112 and an inner side edge 120 aof the source 120 are substantially aligned, for example, and an innerside edge 114 a of the second doped semiconductor layer 114 and an innerside edge 122 a of the drain 122 are, for instance, substantiallyaligned. An outer side edge 112 b of the first doped semiconductor layer112 and an outer side edge 120 b of the source 120 are, for example,substantially aligned. Moreover, an outer side edge 114 b of the seconddoped semiconductor layer 114 and an outer side edge 122 b of the drain122 are, for instance, substantially aligned. The first dopedsemiconductor layer 112 is, for example, located between thesemiconductor layer 104 and the source 120 and covers a first sidesurface 104 a of the semiconductor layer 104. The second dopedsemiconductor layer 114 is, for instance, located between thesemiconductor layer 104 and the drain 122 and covers a second sidesurface 104 b of the semiconductor layer 104. The first side surface 104a and the second side surface 104 b are located at the opposite sides ofthe semiconductor layer 104. In another embodiment, the source 120 andthe drain 122 do not cover the side surfaces of the semiconductor layer104. That is, the outer side edge of the source 120 and the outer sideedge of the drain 122 are substantially aligned to the side surfaces ofthe semiconductor layer 104 (not shown).

Referring to FIG. 2D, a gate insulation layer 130 is formed on thesource 120 and the drain 122 to cover the source 120, the drain 122, andthe semiconductor layer 104. A gate 140 is formed on the gate insulationlayer 130. An insulation layer 150 is formed on the gate 140 to coverthe gate 140, the gate insulation layer 130, the source 120 and thedrain 122, and the semiconductor layer 104. The material and thefabricating method of the gate insulation layer 130, the gate 140, andthe insulation layer 150 can be referred to those described in firstembodiment and thus omitted hereinafter.

In the present embodiment, a TFT 100 a includes the substrate 102, thesemiconductor layer 104, the patterned doped semiconductor layer 110,the source 120 and the drain 122, the gate insulation layer 130, thegate 140, and the insulation layer 150. The semiconductor layer 104 isdisposed on the substrate 102. The patterned doped semiconductor layer110 is disposed on the opposite sides of the semiconductor layer 104.The patterned doped semiconductor layer 110, for example, includes anN-type dopant. The patterned doped semiconductor layer 110, forinstance, includes the first doped semiconductor layer 112 and thesecond doped semiconductor layer 114. The first doped semiconductorlayer 112 is, for example, located between the semiconductor layer 104and the source 120 and covers the first side surface 104 a of thesemiconductor layer 104. The second doped semiconductor layer 114 is,for instance, located between the semiconductor layer 104 and the drain122 and covers the second side surface 104 b of the semiconductor layer104. The first side surface 104 a and the second side surface 104 b arelocated at the opposite sides of the semiconductor layer 104. In thepresent embodiment, the inner side edge 112 a of the first dopedsemiconductor layer 112 and the inner side edge 120 a of the source 120are, for example, substantially aligned. Moreover, the inner side edge114 a of the second doped semiconductor layer 114 and the inner sideedge 122 a of the drain 122 are, for instance, substantially aligned.The outer side edge 112 b of the first doped semiconductor layer 112 andthe outer side edge 120 b of the source 120 are, for example,substantially aligned. Moreover, the outer side edge 114 b of the seconddoped semiconductor layer 114 and the outer side edge 122 b of the drain122 are, for instance, substantially aligned.

The source 120 and the drain 122 are disposed on the patterned dopedsemiconductor layer 110 and on the opposite sides of the semiconductorlayer 104. A part of the semiconductor layer 104 covered by the source120 and the drain 122 has the first thickness t1. A part of thesemiconductor layer 104 located between the source 120 and the drain 122and not covered by the source 120 and the drain 122 has a secondthickness t2 ranging from 200 Å to 800 Å. In the present embodiment, thefirst thickness t1 is generally greater than the second thickness t2.That is, the thickness t1 of the semiconductor layer 104 covered by thesource 120 and the drain 122 is generally greater than the thickness t2of the semiconductor layer 104 located between the source 120 and thedrain 122 and not covered by the source 120 and the drain 122. The firstthickness t1 ranges, for example, from 300 Å to 2000 Å. The secondthickness t2 ranges from 300 Å to 400 Å, for example. The gateinsulation layer 130 is disposed on the source 120, the drain 122 andthe semiconductor layer 104. The gate 140 is disposed on the gateinsulation layer 130. The insulation layer 150 is disposed on the gate140 and the gate insulation layer 130 to cover the gate 140, the gateinsulation layer 130, the source 120 and the drain 122, and thesemiconductor layer 104.

In general, in the process of removing the doped semiconductor materiallayer 108 and the conductor layer 118 to form the patterned dopedsemiconductor layer 110 and the source 120 and the drain 122, thesemiconductor layer 104 (that is, the channel layer) not covered by thesource 120 and the drain 122 can also be removed simultaneously, suchthat the device characteristics of the TFT are affected. Consequently,in the present embodiment, the process of removing the semiconductorlayer 104 is monitored for the semiconductor layer 104 not covered bythe source 120 and the drain 122 to have a thickness ranging from 200 Åto 800 Å. As a result, the TFT 100 a has superior devicecharacteristics. In the present embodiment, the patterned dopedsemiconductor layer 110 is formed by a deposition method such as a CVDmethod, so that a doping machine is not required for forming thepatterned doped semiconductor layer 110. Therefore, the fabrication ofthe TFT 100 a is not limited to the specification of the doping machineand can be incorporated with the conventional amorphous silicon TFTfabrication. In other words, the TFT and the fabricating method thereofallow the TFT to have superior device characteristics and satisfy thedemands for large area production to fabricate a TFT that can be adoptedin large-sized panels, so as to enhance the display quality of thepanel.

It should be noted that although the TFTs 100, 100 a having structuresshown in FIGS. 1D and 2D, and the fabricating methods thereof areillustrated as examples in the embodiments aforementioned, the inventionis not limited thereto. In other words, the TFT of the invention and theconcept of the fabricating method thereof allow the thickness of thesemiconductor layer not covered by the source and the drain to rangefrom 200 Å to 800 Å. As a consequence, the TFT and the fabricatingmethod thereof in the invention can be applied in TFTs having otherstructures. For instance, although the first thickness t1 is generallyequal to the second thickness t2 in the TFT 100 shown in FIG. 1D, inanother embodiment, the first thickness t1 can also be generally greaterthan the second thickness t2 in a TFT having a structure depicted inFIG. 1D. Herein, the second thickness t2 of the semiconductor layer notcovered by the source and the drain ranges from 200 Å to 800 Å.Similarly, in another embodiment, in a TFT having a structure shown inFIG. 2D, the first thickness t1 can also be generally equal to thesecond thickness t2. Here, the thickness t2 of the semiconductor layernot covered by the source and the drain ranges from 200 Å to 800 Å.

In summary, in the TFT of the invention, a part of the semiconductorlayer located between the source and the drain and not covered by thesource and the drain has a thickness ranging from 200 Å to 800 Å, sothat the TFT has superior device characteristics. In one embodiment, inthe formation of the semiconductor layer, the thickness of thesemiconductor layer is maintained from 200 Å to 800 Å, such that thesemiconductor layer of the TFT has an even thickness. In other words,the semiconductor layer located between the source and the drain and notcovered by the source and the drain, and the semiconductor covered bythe source and the drain substantially have the same thickness. Thethickness ranges from 200 Å to 800 Å, and preferably ranges from 300 Åto 400 Å. In another embodiment, after the source and the drain areformed, by removing a part of the semiconductor layer not covered by thesource and the drain, a part of the semiconductor layer not covered bythe source and the drain has a thickness ranging from 200 Å to 800 Å,and preferably ranging from 300 Å to 400 Å. As a result, the TFT hassuperior device characteristics.

Notably, the formation of the TFT in the invention can be incorporatedwith the conventional fabrication of amorphous silicon TFTs to fabricatethe top-gate polysilicon TFT. Here, the amorphous silicon layer istransformed into the polysilicon layer through a crystallization methodsuch as a SPC method. Moreover, the patterned doped semiconductor layeris formed by using a deposition method such as a CVD method, so that thefabrication of the TFT omits the use of a doping machine. Therefore, theTFT and the fabricating method thereof in the invention allow the TFT tohave superior device characteristics and satisfy the demands for largearea production to fabricate a TFT that can be adopted in large-sizedpanels, so as to enhance the display quality of the panel.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of thedisclosed embodiments without departing from the scope or spirit of thedisclosure. In view of the foregoing, it is intended that the disclosurecover modifications and variations of this disclosure provided they fallwithin the scope of the following claims and their equivalents.

What is claimed is:
 1. A fabricating method of a thin film transistor,the method comprising: forming a semiconductor layer having a firstthickness on a substrate; forming a patterned doped semiconductor layeron the semiconductor layer; forming a source and a drain on thepatterned doped semiconductor layer, the source and the drain disposedon opposite sides of the semiconductor layer, wherein the part of thesemiconductor layer located between the source and the drain and notcovered by the source and the drain has a second thickness ranging from400 Å to 800 Å; forming a gate insulation layer on the source and thedrain to cover the source and the drain and the semiconductor layer; andforming a gate on the gate insulation layer.
 2. The fabricating methodof the thin film transistor as claimed in claim 1, wherein the firstthickness is substantially greater than the second thickness.
 3. Thefabricating method of the thin film transistor as claimed in claim 1,wherein the patterned doped semiconductor layer comprises an N-typedopant.
 4. The fabricating method of the thin film transistor as claimedin claim 1, wherein a method of forming the patterned dopedsemiconductor layer comprises a deposition method.
 5. The fabricatingmethod of the thin film transistor as claimed in claim 4, wherein amethod of forming the patterned doped semiconductor layer comprises achemical vapor deposition method.
 6. The fabricating method of the thinfilm transistor as claimed in claim 1, wherein a method of forming thepatterned doped semiconductor layer comprises: forming a semiconductormaterial layer on the semiconductor layer; performing a doping processto transform the semiconductor material layer into a doped semiconductormaterial layer; and removing a part of the doped semiconductor materiallayer to form the patterned doped semiconductor layer on the oppositesides of the semiconductor layer.
 7. The fabricating method of the thinfilm transistor as claimed in claim 1, wherein a method of forming thepatterned doped semiconductor layer and a method of forming the sourceand the drain comprise: forming a doped semiconductor material layer anda conductor layer on the semiconductor layer sequentially; forming apatterned mask layer on the conductor layer; and using the patternedmask layer as a mask to remove a part of the conductor layer and a partof the doped semiconductor material layer for forming the source and thedrain and the patterned doped semiconductor layer, such that thesemiconductor layer not covered by the source and the drain has thesecond thickness.
 8. The fabricating method of the thin film transistoras claimed in claim 7, after removing a part of the conductor layer anda part of the doped semiconductor material layer, the method furthercomprising removing a part of the semiconductor layer not covered by thesource and the drain, so that the first thickness is substantiallygreater than the second thickness.
 9. The fabricating method of the thinfilm transistor as claimed in claim 1, wherein a method of forming thesemiconductor layer comprises: forming an amorphous silicon layer on thesubstrate; and transforming the amorphous silicon layer into apolysilicon layer.
 10. The fabricating method of the thin filmtransistor as claimed in claim 9, wherein a method of transforming theamorphous silicon layer into the polysilicon layer comprises a solidphase crystallization method.
 11. The fabricating method of the thinfilm transistor as claimed in claim 1, wherein the first thickness issubstantially equal to the second thickness.